Citation:Wu B Y, Alam M O, Chan Y C, Zhong H W. Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing. Journal of Electronic Materials. 2008;37 (4) :469-476.Download CitationDOI BibTex Tagged XML Date Published:apr DOI